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As a form-in-place gasket/sealant
Polyethylene (PE)
Do not pour unused adhesive back into the original bottle to avoid contamination
leading to incomplete curing and bonding failure
improve construction efficiency
Loctite 3609 Epoxy Gel for Pre-Wave Soldering low temperature cure As a form-in-place gasket/sealantAdhesive epoxy gel for bonding surface mount components to printed circuit boards prior to wave soldering LOCTITE 3609 is a dark red tacky epoxy gel suitable for bonding surface mount components to printed circuit boards prior to wave soldering. It is particularly suitable for applications requiring medium to high dispensing speeds, high precision dispensing specifications, high wet strength and good electrical properties.
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